Xiaomi（小米）has unveiled the XRING O100（玄戒O100）, a high-bandwidth AI accelerator designed for on-device large-model inference. Introduced at the company’s XRING chip technology briefing in Beijing on Aug. 24 alongside the XRING O3 and XRING D100, the chip is part of Xiaomi’s effort to extend its in-house silicon design from smartphones to AI computing and intelligent driving.
Unlike a general-purpose system-on-chip, the O100 is built to address the memory-bandwidth constraints that can limit local large-language-model inference. Xiaomi said the 6nm accelerator uses wafer-on-wafer 3D stacking and hybrid bonding to vertically integrate a logic die with two layers of AI-focused DRAM. The architecture uses face-to-face metal interconnection, a 1.4-micron bonding pitch and 0.7-micron through-silicon vias to shorten the path between memory and compute.
Xiaomi claims the design delivers 1.22TB/s of near-memory bandwidth—about 16 times that of mainstream smartphone memory—and supports inference speeds of up to 330 tokens per second when running its MiMo 3B model. The O100 includes a 14-core NPU and Xiaomi’s proprietary high-bandwidth matrix bus, which the company says can dynamically adjust data-routing topologies for different stages of model inference.
The O100 was unveiled with two further members of Xiaomi’s expanding XRING portfolio. The 3nm XRING O3 flagship mobile SoC recorded an AnTuTu score of more than 5.22 million, according to Xiaomi, and is set to debut in the Xiaomi 18 Fold in September. The 3nm XRING D100, aimed at intelligent-driving applications, integrates a 20-core CPU and 16-core NPU. Xiaomi says it supports up to 160GB of unified memory and local deployment of models with more than 200 billion parameters.
Xiaomi said the O100 and D100 have completed development and are expected to enter commercial use next year. The company has also said that cumulative shipments of devices using the previous-generation XRING O1 have surpassed one million. Lei Jun（雷军）has previously committed Xiaomi to a long-term chip-development programme involving at least CNY 50 billion in investment over a decade.
The announcement does not mean Xiaomi manufactures chips in-house: the company designs the XRING family, while Taiwan Semiconductor Manufacturing Co. is reported to manufacture the O3, O100 and D100. Still, deeper control of chip architecture gives Xiaomi more scope to optimise its HyperOS software, MiMo models and device hardware together—particularly across its “human-car-home” ecosystem.
For Chinese technology companies expanding overseas, the O100 illustrates a broader shift from exporting finished devices to building differentiated technology stacks around them. Its commercial performance remains untested, and Xiaomi has not yet named the first O100-powered product. But the chip shows how advanced packaging and memory-centric design can become an alternative route to AI performance, alongside continued competition over leading-edge process nodes.
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