Tianqi lithium: determine the global offering of H shares and listing on the Hong Kong Stock Exchange

Survival Rules for Turbulent Times: A Compilation of the 20 Most Unmissable Core Insights from the 2026 Tsinghua PBCSF Forum

A dialogue between Zhu Min, former Deputy Governor of the People's Bank of China and former Vice Managing Director of the International Monetary Fund; Michael Spence, 2001 Nobel Prize winner in Economics and Philip H. Knight Professor Emeritus of Management at Stanford Graduate School of Business; and Masaaki Shirakawa, former Governor of the Bank of Japan, at the 2026 Tsinghua PBCSF Global Finance Forum.

iSoftStone Subsidiary Signs USD 190 Million MECHREVO Laptop Contract

iSoftStone（软通动力）said on October 27 that its wholly owned subsidiary Aistone Global Limited（智通国际）had signed a USD 190.35 million contract to supply 309,000 MECHREVO（机械革命）laptops and warranty services through local repair centres.

Lens Technology Reports AI Server Component Orders as Dongguan Capacity Enters Ramp-Up

Lens Technology（蓝思科技）said in an October 26 investor-relations disclosure that it had completed an expansion of AI server-related capacity at its Songshan Lake campus in Dongguan. The company said liquid-cooling modules, high-end precision cabinets and high-speed optical interconnect components had passed validation by leading North American computing companies and secured volume orders, with production entering the ramp-up stage.

DSBJ Sets Hong Kong Offer Price at HK$86.80 Ahead of Planned October 28 Listing

Suzhou Dongshan Precision Manufacturing Co., Ltd.（苏州东山精密制造股份有限公司）, known as DSBJ, disclosed a final Hong Kong offer price of HK$86.80 per share ahead of its scheduled October 28 main-board debut. The offering would give the Chinese electronics manufacturer an additional offshore financing channel as it expands its printed circuit board and optical communications businesses.

Silicon Integrity Passes HKEX Hearing as Capacity Expansion Keeps Margins Under Pressure

Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.（江苏芯德半导体科技股份有限公司）has passed its Hong Kong main-board listing hearing, with post-hearing documents disclosed on October 21. Huatai International（华泰国际）is the sole sponsor. The proposed listing would provide another financing channel for the Chinese chip-packaging and testing company as it expands production while continuing to report losses.