Sandtek, a provider of semiconductor equipment and accessories, bags CNY 100 Million (USD 14.74 million) in a strategic financing round, invested by several institutions.
Sandtek Corporation (Chinese:胜达克半导体科技), a provider of semiconductor equipment and accessories research and development, announced the closing of a strategic funding round worth CNY 100 million (USD 14.74 million), invested by Hillhouse Investment, FWI CAPITAL MANAGEMENT and Guangdong Hengyitai, news portal lieyun.com reported.
Sandtek Corporation, established in 2016, is an equipment provider focusing on the research, development, production and sales of special equipment in the field of back-end packaging and testing in the semiconductor industry. Its products are mainly used to meet the needs of semiconductor packaging and testing manufacturers for integrated circuit packaging and testing and other mechanical automation production.
The global system-on-chip (SoC) test system market is huge, but it is still dominated by a few companies including Teradyne, Advantest and Chroma ATE. Relying on import substitution opportunities, aided by the policy support of the semiconductor industry chain, Sandtek has developed rapidly in the past few years and has been recognized by many semiconductor manufacturers.
SoC, an entire system on a single chip, is essentially an integrated circuit or an IC that takes a single platform and integrates an entire electronic or computer system onto it. Depending on the kind of system that has been reduced to the size of a chip, it can perform a variety of functions including signal processing, wireless communication, artificial intelligence and more.
Sandtek’s international competitors include Teradyne and Advantest and domestic ones include Allwinner(Chinese:全志科技), Rockchip(Chinese:瑞芯微) and Ninestar(Chinese:纳思达).