Beno electronic materials completed tens of millions of yuan of B + round financing, and index capital acted as the exclusive financial adviser

On February 16, beno electronic materials, the leading benchmark enterprise of chip grade adhesive in China, announced that it had completed tens of millions of yuan of B + round financing. This round of financing was led by Jiangsu Xinchao Technology Group Co., Ltd. (Xinchao Technology), followed by Jiangsu Private Investment Holding Co., Ltd. (Sumin investment), and index capital served as the exclusive financial adviser. The financing fund is planned to be used for R & D investment and capacity expansion. Beno electronic materials, founded in 2009, is a professional supplier of chip level adhesive products and solutions. Its products are widely used in the field of electronic assembly and semiconductor packaging. With the international advanced technology platform with independent intellectual property rights, beno electronic materials has built a platform covering integrated circuit packaging, consumer electronics Electronic adhesive product matrix for multiple application scenarios such as Internet of things and industrial and automotive electronics. After more than 20 years of deep cultivation in the industry, beno electronic's founding team and core team have obvious background advantages. They come from Imperial College of technology, Fudan University, University of science and technology of China, Tianjin University, East China University of technology and Shanghai University and other internationally leading well-known universities in the construction of chemical engineering disciplines, including Henkel chemistry, Dow chemistry Fule chemical, Showa chemical and other global leading fine chemicals enterprises. The senior management team is composed of a group of young backbone with strong academic background, technical advantages, product capability, management experience and industrial resources, and is growing rapidly.